Congratulations to Prof. Jason Cong for receiving the “Global Industry Leader” Award from ChipEx’2023 on May 8, 2023 in Tel Aviv, Israel, for “groundbreaking research and development which revolutionized electronic design automation and FPGA design methods, for co-founding several chip design related companies, and for teaching hundreds of UCLA students, many of them who now hold influential roles in the semiconductor industry”.  ChipEx is the largest annual conference dedicated to the Israeli Semiconductor Industry.  The award was presented by John Neuffer, President and CEO of the (US) Semiconductor Industry Association (SIA), Ami Appelbaum, Chief Scientist of the Israel Ministry of Economy & Chairman and Israel Innovation Authority, and Co-Chairman of ChipEx’2023 Ran Ginosar and Shlomo Gradman.

Previous recipients of the “Global Industry Leader” Award include global leaders in the semiconductor industry, such as Irwin Jacobs, Co-founder of Qualcomm; Henry Samueli, Co-founder of Broadcom; Ray Bingham, former CEO/Chairman of Cadence Design Systems; Wally Rhines, Chief Executive Officer, Mentor Graphics; Johny Srouji, Senior Vice President of Hardware Technologies, Apple; and Andrew Viterbi, Co-Founder of Qualcomm.